Alchip’s close partnerships with leading foundries, packaging and testing partners accelerate the process from engineering samples to Chip diagnosis and manufacturing. Through these close ties, Alchip has access to advanced processes, packaging and testing technologies.
Alchip has a proven track record in advanced packaging such as small/light packages (Chip Scale Package), flip chip BGA packages with as many as 8 layers of buildup substrate, and high power/speed packages that can handle as much as 80W or 1.6Gbps. We also offer better testing solutions that include writing more efficient testing programs on advanced testers.
By establishing these partnerships and combining them with Alchip's prototyping engineering capabilities, Alchip can deliver to its customers a prototype sample in the fastest possible turnaround time.