Provide cutting-edge SoC package
Alchip offers a wide range of package solutions from low-end QFN / QFP to high-end packages such as FCBGA (Flip Chip), MCM (Multi Chip Module), WLCSP (Wafer Level CSP), and 2.5D CoWoS.
In particular, our Cu wire bonding with high-power, high-power flip-chip and micro-bump chip-on-chip technology using a substrate with a body size exceeding 85×85 mm2 and 14 layers remains a pioneer in the world today. We have sufficient mass production records to demonstrate our manufacturing capability in handling our customer products in mass production.
『出典：JEITA website』
Provide cutting-edge SoC package
Alchip offers a wide range of package solutions from low-end QFN / QFP to high-end packages such as FCBGA (Flip Chip), MCM (Multi Chip Module), WLCSP (Wafer Level CSP), and 2.5D CoWoS.
In particular, our Cu wire bonding with high-power, high-power flip-chip and micro-bump chip-on-chip technology using a substrate with a body size exceeding 85×85 mm2 and 14 layers remains a pioneer in the world today. We have sufficient mass production records to demonstrate our manufacturing capability in handling our customer products in mass production.
『出典：JEITA website』
Package / substrate design
With an in-house design system, it makes us possible to design an optimal substrate through close cooperation between the SoC designer and the substrate designer. It provides the best solution to balance between performance, cost and schedule.
Package / substrate design
With an in-house design system, it makes us possible to design an optimal substrate through close cooperation between the SoC designer and the substrate designer. It provides the best solution to balance between performance, cost and schedule.
