| > Production > Quality/Reliability |
| Quality
Policy |
| Quality to meet customer satisfaction with continuous improvement |
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| ISO 9001 |
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By implementing a strict quality policy, Alchip is dedicated to ensuring that our products and services meet our customers’ requirements. Our goal is to achieve maximum customer satisfaction at all times.
| Alchip quality policy is based on 3 fundamental principles: |
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Ensuring that we fully understand our customer’s needs. |
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Complying with the quality standards set out in ISO 9001. |
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To continuously develop and improve a quality management system in order to be a leading company in the semiconductor industry. |
The quality policy objectives are communicated to all employees on a regular basis. All employees are committed to providing the best quality service with the most up-to-date knowledge and skills and are dedicated to continuous improvement in order to achieve to total customer satisfaction. Alchip constantly reviews and improves its services to ensure that tasks are implemented in the most cost effective and timely manner to the benefit of all our customers. |
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| Environmental Management on Materials,Process and Products |
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| SONY Green Partner |
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Green Partner Certificate
Awarded by Sony:
• Compliance to SONY Green Package management requirements.
• Certificate No. SCK 11089
• Certificate Issued: Dec 10, 2008
• Certificate Validity: until Nov 30, 2010
• Certification Body: Procurement Center, Sony Corporation
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Quality Reliability Assurance
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Alchip's Quality and Reliability
Assurance consists of three major parts: Quality System/Document
Control Center, Quality Assurance, and Reliability Assurance.
The Quality System/Document Control Center handles ISO maintenance,
quality related training, quality system improvement, ISO
documentation control, and external documentation control.
Our Quality Assurance team evaluates new suppliers, handles
supplier quality control, and changes in engineering management.
Alchip's Reliability Assurance is achieved through detailed
planning and execution with a focus on reliability, pre-sales
support and continuous improvement related to product reliability. |
Reliability Test Items
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This table describes a baseline set of acceptance tests
for use in qualifying new products or a product family. These
tests are stimulating and precipitating semiconductor device
and packaging failures. The objective is to precipitate failures
in an accelerated manner compared to use conditions. |
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Qualification Description
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Pre-Condition: |
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To simulate the environment
conditions of the SMT process. Pop-corn, poor solderability,
can be found on failed parts.Improper molding material
& process may induce this failure. |
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HTST(High Temperature Storage Test): |
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To detect the effect of time
and temperature under storage conditions, for thermally
activated failure mechanisms of solid state electronic devices. |
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TCT (Temperature Cycle Test): |
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To enhance the mechanical stress
induced by different thermal expansion coefficient
of the materials. Delamination, package crack, can be found
on failed samples. Poor molding process, lead frame
integrity & die attach process may induce this
failure. |
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HAST (Highly Accelerated temperature & humidity
Stress Test): |
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To verify the capability of
packages to prevent the moisture penetration. This
moisture penetration will make the metallization, PAD, wire corrosion
and malfunction. |
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ESD (Electro Static Discharge): |
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To determine the resistance
of ESD, including HBM (human body mode), and CDM
(charged device mode). The capability of ESD resistance
is the intrinsic circuit characteristic of chip.
The higher ESD resistance capability, the more chips
will survive under worst application condition. |
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Latch-up: |
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To verify the circuit resistance
to latch-up. Latch-up is also an intrinsic characteristic
of a chip, & depends on the devices arrangement of circuit.
It is important to reduce the EOS (electrical over
stress) failure due to latch-up. |
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HTOL (High Temperature Operation Life-time Test): |
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Using temperature and voltage
to stress ICs to determine operation lifetime of
ICs due to foundry process, & to evaluate lifetimes of ICs. |
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Continual Improvement
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