Chiplet Technology Critical to Extending Moore’s Law
James Huang, Vice President of R&D, Alchip Technologies sees a chiplet revolution as the cost-effective extender of Moore’s Law……
James Huang, Vice President of R&D, Alchip Technologies sees a chiplet revolution as the cost-effective extender of Moore’s Law……
Alchip Technologies’ 2021 second quarter financial results set records for revenue and net income. This is the sixth consecutive quarter in which the company has reported record financial results……
The global high end ASIC market will reach nearly $20 billion in five years, driven by high-performance computing applications in data processing and telecommunications, according to James Huang, Vice President, Alchip Technologies……
Alchip Technologies, Limited, the high-performance computing ASIC leader, revealed today that demand for post-GDSII backend services has increased exponentially across all high-performance computing ASIC applications……
Alchip Technologies, Limited, the high-performance computing ASIC leader, revealed today that demand for post-GDSII backend services has increased exponentially across all high-performance computing ASIC applications……
Alchip Technologies third quarter of 2020 achieved a record net income $7.87 million on record revenue of $67.68 million. The company also reported continued growth in the high-performance computing market segment……
Alchip Technologies to became the first dedicated ASIC company to announce 5nm commercial design readiness and that is accepting 5nm design. First test-chip tape-outs are expected in December……..
With the number of expected tape outs jumping to nine by the end of 2020 Alchip Technologies, Limited has become one of the leading advanced technology ASIC providers. Alchip revealed that it had completed 3 tape outs in May alone……..
Alchip Technologies first quarter of 2020 achieved a record net income $5.79 million on record revenue of $50.49 million. The company also guided that it would set new records in Q2, despite the effects of the global pandemic……
Alchip Technologies, Limited, the high-performance computing ASIC leader, rolled out its Chip-on-Wafer-on-Substrate (CoWoS®) packaging capability. CoWoS packaging, developed first by TSMC, is critical to successful deployment of today’s High-Performance Computing (HPC) ASICs……
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